Citizen CBM-202 Series Instrukcja Użytkownika

CONTROL IC FOR LINE THERMAL PRINTER (FOR LT SERIES)SPECIFICATIONS MODEL CBM-202LA

10PINNO.SIGNALNAMEI/ODIRECTIONPIN CHARACTERISTIC FUNCTION91 Vdd - VDD92 A0 Input CMOS type with pull-up Address bus input93 CLK16M Input CMOS type wit

114.6 INTERNAL ADDRESS MAPA3 A2 A1 A0 RD HWR CS1 OPERATION AND APPLICABLE PORT0000010Prohibited0000100Print data buffer0001010Prohibited0001100DMA req

124.7 PRINT DATA TRANSFER METHODWhen printing is performed with Line Thermal Head at high speed, it is necessary for you either to control printing sp

13Data transfer sequence is shown as follows:The following procedures are needed for printing operation:1. Turning on HVC port pin, supply Vp voltage

14The whole sequence is shown as follows:4.8 RESET CIRCUITWith RES pin (No 94 pin) set to "Low" level, STB 1㨪3 (No's 9 㨪11 pins) are m

154.9 SYSTEM CLOCK CIRCUITIn order to acquire speed to transfer data to Head, input 16MHz clock in CLK16M pin (Pin 93.) Divide this clock internall

164.12 PARALLEL INPUT CIRCUITThis port is used as being shared by PCI (0㨪7), 8-bit parallel general purpose input. STB input, ACK output and BUSY o

17MIN MAX UNITT1 80 nsT2 80 nsT3 80 ns4.14 GENERAL PURPOSE I/O OUTPUT CIRCUITBesides the PAO ports and PCI ports mentioned above, there are some other

18c) 90° Turning Circuit1. Write, in the 90° turning data buffer which extends from Address XX08h to XX0Fh, the data to be turned.2. In the same way,

194.16 PSEUDO-SRAM CONNECTING METHODIn the system consisted of the CPU and gate array, S-RAM may be used as the work area as the print data buffer, bi

2CONTENTS1 OUTLINE...

205 OPERATION TIMINGOperation timings immediately following initialization are shown below:

216 PACKAGE SPECIFICATION6.1 SHAPE AND DIMENSIONSOUTLINE DRAWING MaterialMain body: epoxy type resin / satin finish for marking faceLead: iro

226.2 MOUNT PAD DIMENSIONS UNIT: mmNO OF PINS PER SIDE PIN PITCH PAD WIDTH PAD LENGTH FITTING WIDTHED e b2 12MieMid20 30 0.65

237 REFERENTIAL CIRCUIT DIAGRAM

24

258 REMARKS FOR MOUNTING8.1 TEMPERATURE CONDITIONS FOR MOUNTINGx Infrared Reflow SystemRecommended ConditionsPeak temperature : 230ºC and less (packag

268.2 STORAGE CONDITIONSResin material of the plastic mold package absorbs moisture when exposed in a room. If the package being mounted with moist

279 PACKING SPECIFICATIONSUnit mm Heat resistant conductive plasticApplicable Package No Per Packing100-pin plastic QFP 60

281. Item Packaging Container 2. Item Packaging Box Label position Top or side face of boxLabel content Product name, amount, lot

31 OUTLINEIn order to assure proper operation, be sure to use this Gate Array following the contents of this specifications.Absolutely, do not carry o

42 GENERAL SPECIFICATIONS2.1 SHAPE AND DIMENSIONS100-pin plastic QFP package23.6 u 17.6 u 2.7 (mm)(See Section 6. PACKAGE SPECIFICATION.)2.2 STRUCTURE

53 OUTLINE OF CIRCUITS3.1 THERMAL HYSTERESIS CONTROLWhen Line Thermal Head performs printing at high speed, heat remaining from printing which is one

64 DETAILED SPECIFICATIONS OF HARDWARE4.1 ABSOLUTE MAXIMUM RATINGSITEM SYMBOL CONDITIONS RATINGS UNITSupply Voltage Vdd -0.5 to +6.5 VI/O Voltage Vi/

7SWITCHING CHARACTERISTICS (Unless otherwise specified, Vdd=5V r10%, Ta=-40㨪+85 ºC)ITEM SYMBOL CONDITION MIN TYP. MAX UNITToggle Frequency ftog Inter

84.4 TERMINALS AND THEIR FUNCTIONSPINNO.SIGNALNAMEI/ODIRECTIONPIN CHARACTERISTIC FUNCTION1 GND - GND2 RAMOE Output CMOS9mA type with pull-up OE/RFSH p

9PINNO.SIGNALNAMEI/ODIRECTIONPIN CHARACTERISTIC FUNCTION46 PC15 Input CMOS type with pull-up Preset & Centro-data input47 PC14 Input CMOS type wit